| 摘要 |
A probe card (4) being connected with a means for evaluating the characteristics of a minute structure by delivering a test sound wave to the movable portion (16a) of the minute structure formed on a wafer (8) comprises a probe (4a) connected electrically with the inspection electrode of the minute structure formed on the wafer (8) in order to detect electrical variation based on the movement of the movable portion (16a) formed on the wafer (8) during test, and at least one of a sound absorption material (11), a shield portion (18) and a horn (19) for suppressing reflection or interference of the test sound wave. A diffusion portion may be provided in place of the sound absorption material (11) or in addition to the sound absorption material (11). The inspection device of a minute structure comprises a probe card (4) having the sound absorption material (11), the shield portion (18) or the horn (19). ® KIPO & WIPO 2009
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