发明名称 |
Leadframe having fine pitch bond fingers formed using laser cutting method |
摘要 |
Methods of making a leadframe and a semiconductor package made using the leadframe are disclosed. One embodiment of such a method includes providing a metal sheet and patterning the metal sheet to form a plurality of leads. An inner end portion of each lead is joined into a block with the inner end portion of one or more adjacent leads. Subsequently, the end block is cut with a laser to singulate the inner end portion of each of the leads from the end block. This method can further comprise reducing a thickness of the end block relative to an initial thickness of the metal sheet, prior to the laser cutting step, to make the laser cutting easier.
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申请公布号 |
US2004053447(A1) |
申请公布日期 |
2004.03.18 |
申请号 |
US20010895501 |
申请日期 |
2001.06.29 |
申请人 |
FOSTER DONALD CRAIG;MCKENDRICK KELLY ROBBINS |
发明人 |
FOSTER DONALD CRAIG;MCKENDRICK KELLY ROBBINS |
分类号 |
H01L21/48;H01L23/495;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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