发明名称 ELECTRONIC PARTS APPARATUS AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an excellent shock-proof electronic parts apparatus capable of making the height thereof lower without causing short-circuitting between a metal cover member and a circuit parts component. <P>SOLUTION: The electronic parts apparatus is one including a metal cover member 6 for coating circuit parts components 2 and 3 mounted on a wiring board 1. An insulating resin layer 8 is interposed between the circuit parts components 2, 3 and the metal cover member 6, and the metal cover member 6 is held with a column member 9 provided vertically on the wiring board 1. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004088088(A) 申请公布日期 2004.03.18
申请号 JP20030183507 申请日期 2003.06.26
申请人 KYOCERA CORP 发明人 HATANAKA HIDEFUMI;MIURA HIROYUKI
分类号 H01L23/00;(IPC1-7):H01L23/00 主分类号 H01L23/00
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