| 摘要 |
PROBLEM TO BE SOLVED: To provide a device of peeling a film which can peel a film with higher accuracy by supplying water vapor well, and to provide a method of peeling the film. SOLUTION: The peeling device 1000 comprising a processing chamber 10 for peeling a film formed on a wafer 1, a water vapor generating unit 26a for generating water vapor which is supplied to the processing chamber 10, and a carrier gas supply unit 28 for supplying a carrier gas to the water vapor generating unit 26a. COPYRIGHT: (C)2004,JPO
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