发明名称 METHOD FOR MANUFACTURING CONDUCTIVE PATTERN FORM
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive pattern whereby a high-definition pattern is formed by using a simplified process without raising problems involving waste liquid disposal or the like. SOLUTION: The method for manufacturing a conductive pattern form has a step of preparing a pattern forming substrate 3 comprising a substrate 1 and a photocatalyst-containing layer 2 which is formed on the substrate 1 and contains a photocatalyst and a binder and wherein the wettability of an energy-irradiated part changes toward a direction where the contact angle of the liquid is narrowed. The method also has a step of forming a wettable pattern comprising lyophobic regions 7 and lyophilic regions 6 formed on the photocatalyst-containing layer 2 by patterned energy application to the photocatalyst-containing layer 2, a step of applying metallic paste to the surface of the photocatalyst-containing layer 2 having the wettable pattern thereon, and a step of solidifying the metallic paste adhering to the lyophilic regions 6 of the wettable pattern for development into conductive regions 8. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004087976(A) 申请公布日期 2004.03.18
申请号 JP20020249613 申请日期 2002.08.28
申请人 DAINIPPON PRINTING CO LTD 发明人 KOBAYASHI HIRONORI
分类号 H05K3/10;H05K3/12;(IPC1-7):H05K3/10 主分类号 H05K3/10
代理机构 代理人
主权项
地址