| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which the portion of a coating insulating resin layer covering an isolated-region land section has a sufficient thickness to secure the insulating property, moisture resistance, etc., of the land section. SOLUTION: The method of manufacturing the wiring board 100 includes a first filling via conductor forming step, a first coating insulating resin layer forming step, a second filling via conductor forming step, and a second coating insulating resin layer forming step. In the first filling via conductor forming step, an isolated-region filling via conductor 210c is formed and, at the same time, a surrounding conductor layer 260 which surrounds an isolated region land section 210c through a gap is formed. In the second filling via conductor forming step, an isolated-region filling via conductor 110c and isolated-region wiring 150 are formed and, at the same time, a surrounding conductor layer 160 which surround the isolated-region land section 110c through a gap is formed along the isolated region wiring 150 with a gap in between. COPYRIGHT: (C)2004,JPO
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