| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an etching device which is capable of forming irregularities uniformly on the surface of a board. <P>SOLUTION: An etching operation is carried out by the use of the etching device in such a manner where the boards 1 placed on a tray 13 are arranged on an electrode located inside a chamber, covered with a plate member 14 with openings, and subjected to etching. A distance between the periphery of the plate member 14 and the boards 1 is set shorter than that between the center of the plate member 14 and the boards 1. <P>COPYRIGHT: (C)2004,JPO</p> |
