发明名称 |
SUBSTRATE PROCESSING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device whose influence on substrate processing by heat from an exhaust vessel is reduced. SOLUTION: Processing part groups G3 and G4 include a pre-baking unit PREBKE and a post-baking unit POBAKE as a heat processing part respectively. At the upper side of a conveyance chamber 215 where a main conveyance robot 210 is arranged, an exhaust vessel 220 is arranged. This exhaust vessel 220 is combined by each processing part provided at the processing part groups G3 and G4 and by a secondary exhaust pipe SP respectively. A plurality of secondary exhaust pipes SP have its diameter and length adjusted so that the pressure loss becomes almost equal to each other. Also, the exhaust vessel 220 is connected to a negative pressure source 225 via a main exhaust pipe MP. At one part of the main exhaust pipe MP, a damper 226 is interposed. The total exhaust throughput can be adjusted by adjusting this damper 226. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004088104(A) |
申请公布日期 |
2004.03.18 |
申请号 |
JP20030293727 |
申请日期 |
2003.08.15 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
TSUCHIYA AKIO;HARA TAKASHI |
分类号 |
H01L21/027;H01L21/02;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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