| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a cost while a heat sink is assured in a semiconductor package of a flip-chip ball grid array structure. <P>SOLUTION: A semiconductor device includes a metal substrate having an insulator provided on a rear surface and covered with a conductive metal and having wirings and lands formed corresponding to pad positions of a mounting semiconductor chip; the chip connected to the land of the wiring of the substrate via a bump; and a substrate in which wirings, through holes and lands formed previously to connect to the metal substrate via the bump, and a recess shape formed at a semiconductor chip mounting part, and solder balls mounted for external connections. <P>COPYRIGHT: (C)2004,JPO |
