SEMICONDUCTOR CHIP PACKAGE WITH HEAT SPREADER INCLUDING DIAMOND COATING LAYER

摘要

PURPOSE: A semiconductor chip package with a heat spreader including a diamond coating layer is provided to improve heat characteristic and prevent damage to a chip by using an electrostatic discharge effect. CONSTITUTION: An integrated circuit is formed in a semiconductor chip(110). A circuit interconnection(221) is formed in a substrate. A through hole is formed inside the substrate. The heat sink(130) is attached to the surface of the substrate. The back surface of the semiconductor chip is attached to the position of the through hole of the substrate. A bonding wire(125) electrically connects the semiconductor chip with the substrate. An external connection terminal is attached to the substrate. A coating layer(131) of a diamond material is formed in the heat spreader.