| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component fabricating method capable of forming at once and certainly rectangularly recessed grooves that have dimensions as previously specified. <P>SOLUTION: The laminated electronic component fabricating method comprise a process for fabricating molded element main body 23 made by laminating green sheets 1 and internal electrode patterns 3, that for eliminating binder of the molded element main body 23 to make the element main body 31 by baking and that for forming a couple of external electrodes 33 in side faces of the element main body 31. The element main body 23 comprise exposed ends of the internal electrode patterns 3 in the side faces thereof. The rectangularly recessed grooves 21 filled with scattered matter 11 resolved by thermal treatment are formed alternately every other layer of the internal electrode patterns 3 and besides the scattered matter 11 contains low temperature resolving organic matter that resolves and scatters in low temperature regions and high temperature one that does in high temperature regions. <P>COPYRIGHT: (C)2004,JPO |
