| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic electronic part including a step of cutting out a laminate from a mother substrate without interlayer releasing. SOLUTION: The mother substrate is formed by laminating a plurality of ceramic green sheets each made of conductive paste in a predetermined pattern on the surfaces. This mother substrate is heat treated at a temperature higher than the boiling point of a plasticizer included in the mother substrate and lower than the decomposing temperature of a binder, and then cut out into a plurality of laminates. These laminates are heat treated to burn organic materials contained in the laminates, the laminates are further baked to form ceramic sintered materials, and external electrodes are provided on the sintered material to form a laminated ceramic electronic part. Here. The drying temperature is 100 to 180°C or preferably 120 to 150°C. COPYRIGHT: (C)2004,JPO
|
