EQUIPMENT FOR POLISHING SEMICONDUCTOR WAFER

摘要

PURPOSE: Equipment for polishing a semiconductor wafer is provided to minimize scratch and a defect of a wafer in a polishing process by pushing foreign substance on a polishing pad together with a cleaning solution toward the outside after a polishing head rotates and moves in the right and left direction. CONSTITUTION: A polishing station(110) has a platen to which the polishing pad(112) is attached. The polishing head(130) polishes the wafer on the polishing pad of the platen. The first cleaning apparatus supplies fluid to the polishing pad, installed in the polishing head to clean the polishing pad along the movement locus of the polishing head.