发明名称 UPPER TAPE TREATING APPARATUS OF TAPED COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To raise the operation rate of an apparatus such as a chip mounter or the like by enabling an upper tape separated from a taped component set to the apparatus to be discharged in a simple operation. <P>SOLUTION: An upper tape treating apparatus of the taped component treats the upper tape 12 released from and discharged from the component set to the apparatus such as the chip mounter or the like. The treating apparatus includes a delivering mechanism for delivering the upper tape 12 released from the taping component to a discharge side by holding the tape 12 between a drive roller 14 and a pinch roller 16 rotatably driven in the delivering direction of the tape, a guide cylinder 18 having a plurality of suction holes provided at a predetermined interval in a longitudinal direction to pass the tape 12 fed from the mechanism, and a vacuum suction unit 20 connected to a base end side of the cylinder to suck the tape 12 together with an air flow to the inside of the cylinder and to house the tape in a discarding case via the cylinder 18. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004087698(A) 申请公布日期 2004.03.18
申请号 JP20020245413 申请日期 2002.08.26
申请人 SHINANO KENSHI CO LTD 发明人 NIIMI SHUNSUKE
分类号 H05K13/02 主分类号 H05K13/02
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