| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the accuracy in polishing work by easily uniformly supplying the slurry to a surface of a polishing pad with a simple constitution, with respect to the polishing pad, and the polishing device and method suitably applied in polishing a semiconductor board with high polishing accuracy. <P>SOLUTION: This polishing pad 121 composed of an upper polishing pad part 30 provided with a slurry introduction through hole 41 and a plurality of slurry supply through holes 42, and a lower polishing pad part 60 provided with a slurry introducing part 43 and a groove part 71 for slurry passage, is mounted on a platen 110. The slurry supplied from an upper part of the surface of the polishing pad 121 is introduced from the slurry introduction through hole 41, the slurry is guided through the slurry introducing part 43 and the groove part 71 for slurry passage, and the slurry is uniformly supplied to the surface of the polishing pad 121 surface through the slurry supply through holes 42. <P>COPYRIGHT: (C)2004,JPO |
