| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board in which a circuit pattern can be transferred to an insulation board without causing disorder of the circuit pattern and which is excellent in productivity and workability. SOLUTION: The manufacturing method of the circuit board has at least following two processes, that is, a process of adhering the circuit pattern on the insulation board by press-fitting a face on which the circuit pattern of a circuit transfer tape is formed wherein the circuit pattern made of a metal foil is formed on the surface of an adhesive tape, to the insulation board, and a process of transferring the circuit pattern on the insulation board by peeling off the circuit pattern and the adhesive tape. In the adhesive tape, an adhesive layer made of a photo-cross-linkable adhesive of the gel percentage of 10 wt.% or more is formed on the surface of a resin film. When the circuit pattern and the adhesive tape are peeled off, adhesive force of the adhesive tape is reduced by cross-linking the photo-cross-linkable adhesive by irradiation of light from the adhesive tape side of the circuit transfer tape, and the photo-cross-linkable adhesive is a photo-radical polymerization adhesive. COPYRIGHT: (C)2004,JPO
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