| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a wiring board cannot be bonded rigidly to an external electric circuit board because of creeping solder. SOLUTION: The package for containing an electronic component comprises an insulating basic body 1 having a recessed containing part 1a and a frame-like metallic layer 3 on the upper surface, a plurality of wiring conductors 2 having one end leading into the containing part 1a and the other end leading to the side face, a connection pad 4 formed in the outer circumferential part on the lower surface of the insulating basic body 1, a groove-like recess 5a formed in a region between adjacent one ends of the wiring conductors 2 to connect the connection pad 4 with the frame-like metallic layer 3 and having the inner wall face applied with a conductor 6, and a lid 10. A small diameter part 5b having a smaller inside diameter as compared with other parts is formed at a part of the groove-like recess 5a, and the insulating basic body 1 has a swelling part 11 in the region between one end of each of the adjacent wiring conductors 2 on the inner wall face at the containing part 1a and the frame-like metallic layer 3 is extending on the upper surface of the swelling part 11. COPYRIGHT: (C)2004,JPO |
