| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition useful as a semiconductor-sealing material, a resin composition for electronic circuit boards, a resin casting material, an adhesive, an interlayer insulating material for build-up boards and a coating material, such as an insulation paint, requiring excellent heat and moisture resistance, a molding-cured product of the epoxy resin composition, and a semiconductor-sealing material and a resin composition for electronic circuit boards containing the epoxy resin composition. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin derived from (a) a four-substituted dihydroxybenzene having one or more substituents selected from benzyl, 1-phenylethyl and 1-methyl-1-phenylethyl groups and an epihalohydrin and (B) a curing agent. The cured product is made by molding and curing the epoxy resin composition. The semiconductor-sealing material and the resin composition for the electronic circuit boards contain the epoxy resin composition. COPYRIGHT: (C)2004,JPO
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