METHOD FOR FORMING METAL LAYER PATTERN

摘要

PURPOSE: A method for forming a metal layer pattern is provided to eliminate the need to increase the temperature of a substrate by supporting a metal layer by a photoresist pattern when the metal layer is formed. CONSTITUTION: The first photoresist pattern(121) is formed on a substrate(110). The second photoresist pattern(122) is formed on the first pattern. A metal seed layer(130) of a metal material for forming a seed layer is formed on the substrate in which the first and second patterns are sequentially formed. The second pattern is dissolved by using an organic solvent to separate the second pattern and the metal material for forming the seed layer formed on the second pattern. A metal layer made of a metal material for forming a layer is formed on the substrate including the metal seed layer. The first pattern is dissolved by using an organic solvent to separate the first pattern and the metal material for forming the layer formed on the first pattern.