| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device capable of forming an external electrode of a chip type electronic component capable of accurately forming the external electrode, and remarkably reducing the cost. SOLUTION: This device is provided with adhesive sheet sticking parts A and G for respectively sticking adhesive sheets 2a and 2b on endless belts 1a and 1b, a parts supplying section B for holding a first end of a chip type electronic component element 10 on the adhesive sheet 2a, a primary forming part C for forming a conductive film to be a second external electrode on a second end of the chip type electronic component element 10, a transferring part E for holding the second end on the adhesive sheet 2b while peeling the first end of the chip type electronic component element 10 from the adhesive sheet 2a, a secondary forming part H for forming the conductive film to be a first external electrode on the first end of the chip type electronic component element 10, a parts collection part J, and a primary and secondary adhesive sheet peeling parts F and K for respectively peeling the adhesive sheets 2a and 2b. COPYRIGHT: (C)2004,JPO
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