发明名称 Integrated circuitry, including DRAM integrated circuitry
摘要 In one implementation, integrated circuitry includes a first capacitor electrode layer received over a substrate. A capacitor dielectric layer is received over the first capacitor electrode layer. The capacitor dielectric layer has an edge terminus. A second capacitor electrode layer is received over the capacitor dielectric layer. The first capacitor electrode layer and the second capacitor electrode layer, respectively, have opposing lateral edges. The capacitor dielectric layer edge terminus is laterally coincident with at least a portion of one of the opposing lateral edges of the second capacitor electrode layer. An insulative silicon nitride including cap is received over the capacitor dielectric layer edge terminus and the one opposing lateral edge of the second capacitor electrode layer. The cap does not contact any portion of the opposing lateral edges of the first capacitor electrode layer. Other aspects and implementations are disclosed.
申请公布号 US6707088(B2) 申请公布日期 2004.03.16
申请号 US20020209820 申请日期 2002.07.31
申请人 MICRON TECHNOLOGY, INC. 发明人 FISHBURN FRED
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/02
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