发明名称
摘要 A stacked multi-chip package includes a substrate, a first chip and a second chip. The first chip is fixed to the substrate, and is provided with a collar portion which opposes an upper face of the substrate in a state such that a gap is formed between the upper face of the substrate and the collar portion. The second chip is disposed in a region below the collar portion. The second chip is fixed to the substrate and does not make contact with the first chip.
申请公布号 JP3507059(B2) 申请公布日期 2004.03.15
申请号 JP20020187441 申请日期 2002.06.27
申请人 发明人
分类号 H01L25/18;H01L23/31;H01L25/065;H01L25/07;H01L29/06 主分类号 H01L25/18
代理机构 代理人
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