发明名称 CAPACITOR STRUCTURE, FILM FORMING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a capacitor structure which can control change in capacitance for variation of leak current and applied voltage without excessive increase in the film thickness. SOLUTION: The capacitor structure comprises a lower electrode film 4 consisting of a metal film or a metal compound film, an upper electrode film 8 consisting of a metal film or a metal compound film, and a siliconless high dielectric material film 6 provided between the lower electrode and upper electrode and does not include silicon atom. In addition to the siliconless high dielectric material film, at least one layer of a silicon-doped high dielectric material film 60 including the silicon atom is also provided. Accordingly, change in the capacitance for variation of leak current and applied voltage can be controlled. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004079687(A) 申请公布日期 2004.03.11
申请号 JP20020236098 申请日期 2002.08.13
申请人 TOKYO ELECTRON LTD 发明人 MOROZUMI YUUICHIRO;HASEBE KAZUHIDE;NAKAJIMA SHIGERU;FURUYA HARUHIKO;SAI TOKIN;UMEHARA TAKAHITO;HARADA TOSHISHIGE;FUJIWARA TOMONORI;FUJITA HIROTAKE
分类号 C23C16/42;H01L21/02;H01L21/31;H01L21/316;H01L21/822;H01L27/04;(IPC1-7):H01L21/822 主分类号 C23C16/42
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