发明名称 Semiconductor device and an optical device using the semiconductor device
摘要 A semiconductor device comprising a semiconductor element and a support member having a recess for housing the semiconductor element is disclosed. The support member includes lead electrodes and a support part holding the lead electrodes so that a surface of tip portions of the lead electrodes are exposed in a bottom of the recess. A main surface of the support member has at least a first main surface disposed adjacent to the recess and a second main surface disposed adjacent to the first main surface. The second main surface preferably has a protrusion and a further recess. The protrusion preferably forms an outer wall around a depression. The semiconductor device having this configuration has excellent and accurate positioning and can be strongly bonded with other members. The semiconductor device can also be obtained with a high process yield.
申请公布号 US2004046242(A1) 申请公布日期 2004.03.11
申请号 US20030655323 申请日期 2003.09.05
申请人 ASAKAWA HIDEO 发明人 ASAKAWA HIDEO
分类号 H01L31/0203;H01L33/20;H01L33/48;H01L33/58;H01L33/62;(IPC1-7):H01L23/02 主分类号 H01L31/0203
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