METAL-CLAD POLYIMIDE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To stably provide a metal-clad polyimide substrate having a sufficient adhesive force and enabling sure and easy confirmation and estimation of the adhesive force between the polyimide film and the metal layer even in the form of a two-layer substrate produced without using an adhesive. SOLUTION: The metal-clad polyimide substrate is produced by directly forming a layer of a metal such as nickel and copper on at least one surface of a polyimide film composed of biphenyltetracarboxylic acid dianhydride and p-phenylenediamine. The thickness of the stained region of the substrate measured by the following method is≥30Å. The stained region is observable on the cross-section of the polyimide film formed by removing the metal layer of the substrate by wet etching and immersing the remaining polyimide film in an aqueous solution of silver nitrate. COPYRIGHT: (C)2004,JPO