| 摘要 |
<p>The manufacture of LED involves using MELF, mini-, or micro-MELF casing. A diode chip (3) is located between two metal blocks (1) and sealed by melting in a glass tube (2), with the blocks in electric contact to the respective surface side of the LED chip. At the chip surface sides are fitted with metal bumps (4,5). The outer faces of the blocks are embedded by melting into the glass tube. The diode chip consists of a compound semiconductor of the III-V mixed crystal type. The sealing melting is carried out in vacuum and the material of the glass tube combines directly with the diode chip.</p> |
