发明名称 |
Chip mounting substrate, first level assembly, and second level assembly |
摘要 |
A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands. |
申请公布号 |
US2004046262(A1) |
申请公布日期 |
2004.03.11 |
申请号 |
US20030382020 |
申请日期 |
2003.03.05 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
WATANABE SHINYA;OZAWA ISAO |
分类号 |
H01L23/12;H01L23/498;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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