| 摘要 |
PURPOSE: A heat-dissipation device is provided to enable a fan unit to absorb high-temperature air around other heat-generation component through an entrance port of a guide pipe to extract outside a computer housing, thereby accomplishing an excellent heat-dissipation effect. CONSTITUTION: A thermal superconducting body(4) has a hollow thermal transmission body disposed on a thermal-generation component(5) of an electronic device. The thermal transmission body is configured to define at least one air channel(44). A fan unit(7) is disposed to pull high-temperature air from the thermal transmission body. An entrance port(61) is connected to the thermal transmission body to collect the high-temperature air. An exit port(63) is connected to the fan unit(7). An intermediate pipe portion(62) connects the entrance port(61) with the exit port(63) to guide the high-temperature air to the exit port(63) from the entrance port(61).
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