| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic electronic component aggregate capable of eliminating such a trouble as concentration of stress, or the like, due to difference of shrinkage between the central region and the outer circumferential region of a substrate when it is fired. SOLUTION: A plurality of lattice-like breaking grooves 2 are formed in the major surface of a ceramic electronic component aggregate 1, and a plurality of electronic components 5 are fabricated in a plurality of regions sectioned by these breaking grooves 2. Marginal regions 7 sectioned by the breaking grooves 2 are provided around the regions where the electronic components 5 are disposed. Two through holes 8 are made in each section partitioned by the breaking grooves 2 in the marginal region 7. COPYRIGHT: (C)2004,JPO
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