| 发明名称 |
Microsystem packaging and associated methods |
| 摘要 |
Methods and apparatus are provided for sealing and reducing warpage in a microsystem device. The microsystem device is assembled with a substrate and packaged.
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| 申请公布号 |
US2004046248(A1) |
申请公布日期 |
2004.03.11 |
| 申请号 |
US20020235363 |
申请日期 |
2002.09.05 |
| 申请人 |
CORNING INTELLISENSE CORPORATION |
发明人 |
WAELTI MARC;BOWMAN AMY CATHERINE;TAYLOR WILLIAM PATRICK;ZOU JIN |
| 分类号 |
B81B7/00;G02B6/42;H01L21/58;H01L23/13;H01L23/14;H01L23/16;H01L23/31;(IPC1-7):H01L23/34;H01L23/48;H01L23/52 |
主分类号 |
B81B7/00 |
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