发明名称 SPUTTERING TARGET MATERIAL OF STRONTIUM RUTHENATE AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering target material of strontium ruthenate for stably forming a sputtering film of a lower part electrode of a high quality, by densifying the sputtering target material for forming a film of the lower part electrode of a dielectric capacitor. <P>SOLUTION: This sputtering target material has a composition comprising strontium ruthenate and one or two added sintering auxiliaries of CuO and GeO<SB>2</SB>, and thereby has a density of the sputtering target enhanced into 80% or higher. The method for manufacturing the target comprises pressure-forming the mixed powders and baking it in atmospheric air. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004076021(A) 申请公布日期 2004.03.11
申请号 JP20010305846 申请日期 2001.08.27
申请人 KOJUNDO CHEM LAB CO LTD 发明人 TANAKA KOICHI;KAZAMA HIROSHI;UNNO TAKAHIRO
分类号 C04B35/00;C04B35/495;C23C14/34 主分类号 C04B35/00
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