发明名称 |
PACKAGE FOR A NON-VOLATILE MEMORY DEVICE INCLUDING INTEGRATED PASSIVE DEVICES AND METHOD FOR MAKING THE SAME |
摘要 |
In accordance with one embodiment of the invention, a memory device package includes an integrated circuit die having a memory array and at least one passive component mounted to a substrate. In alternative embodiments, an array of solder balls may be mounted around the passive component. |
申请公布号 |
WO03058717(A3) |
申请公布日期 |
2004.03.11 |
申请号 |
WO2002US39480 |
申请日期 |
2002.12.10 |
申请人 |
INTEL CORPORATION |
发明人 |
WALK, MICHAEL;RABADAM, ELEANOR;KESER, MILAN |
分类号 |
H01L23/13;H01L23/31;H01L23/498;H01L27/112;H05K1/02;H05K1/18 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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