发明名称 SEMICONDUCTOR DEVICE AND OPTICAL DEVICE USING THE SAME
摘要 PURPOSE: A semiconductor device and an optical device using the same are provided to improve the mounting efficiency and the adhering strength by forming the first surface and the second surface on a main surface. CONSTITUTION: A semiconductor device includes a semiconductor element and a support member. The support member includes a recess for housing the semiconductor element. The support member further includes lead electrodes and a support part holding the lead electrodes so that a surface of each of the lead electrodes is exposed in the bottom of the recess. The support member has at least a first surface(1a) disposed adjacent to the recess and a second surface(1b) disposed adjacent to and offset from the first surface.
申请公布号 KR20040022177(A) 申请公布日期 2004.03.11
申请号 KR20030061711 申请日期 2003.09.04
申请人 NICHIA CORPORATION 发明人 ASAKAWA HIDEO
分类号 H01L31/0203;H01L33/20;H01L33/48;H01L33/58;H01L33/62 主分类号 H01L31/0203
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