发明名称 PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board which restrains the separation of a land without deteriorating a soldering strength even when a no-lead solder is used as a connecting solder. SOLUTION: On the printed circuit board, a square land 3 is formed on the printed circuit board and solder resists 4A, 4B are formed on the surface of the same. The board is constituted so that the corners of the square land 3 are coated by the solder resists 4A, 4B. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004071661(A) 申请公布日期 2004.03.04
申请号 JP20020225482 申请日期 2002.08.02
申请人 HITACHI LTD 发明人 HARA SUSUMU
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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