发明名称 RESIN SEALING APPARATUS
摘要 PROBLEM TO BE SOLVED: To enhance molding quality by enabling the adjustment of the quantity of a resin in a cavity. SOLUTION: A resin sealing apparatus 500 is equipped with a mold which is composed of a male mold 100 and a female mold 200, and the resin 204, which is sealed into the cavity 202, is compressed between the male mold 100 and the female mold 200, so that an article 502 to be formed can be sealed. The apparatus 500 is equipped with a sealing mechanism 300 for pressing/sealing the resin 204 into the cavity 202, and a gate 208 which enables a part of the resin 204, sealed by the sealing mechanism 300, to be discharged as an excess resin to the outside of the cavity 202. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004066536(A) 申请公布日期 2004.03.04
申请号 JP20020226230 申请日期 2002.08.02
申请人 SAINEKKUSU:KK 发明人 YANAI MITSUHIRO
分类号 B29C45/28;B29C45/02;B29C45/70;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/28
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