发明名称 |
Solder mask on bonding ring |
摘要 |
An improvement to an integrated circuit package substrate of the type that has a bonding ring with an exposed upper surface, where a first portion of the exposed upper surface is for receiving a molding compound and a second portion of the exposed upper surface is for receiving an electrical connection. A solder mask is formed on the first portion of the exposed upper surface of the bonding ring.
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申请公布号 |
US2004041252(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
US20020229659 |
申请日期 |
2002.08.28 |
申请人 |
OTHIENO MAURICE;THURAIRAJARATNAM ARITHARAN;THAVARAJAH MANICKAM;PATEL PRADIP D.;LEGASPI SEVERINO A. |
发明人 |
OTHIENO MAURICE;THURAIRAJARATNAM ARITHARAN;THAVARAJAH MANICKAM;PATEL PRADIP D.;LEGASPI SEVERINO A. |
分类号 |
H01L23/498;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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