Production of light-emitting diode, e.g. for optical display, traffic-lights or data storage, communications, lighting or medical equipment, involves applying reaction layers to LED stack and reflection layer and bonding with clear adhesive

摘要

Method (A) for producing a light-emitting diode (LED) with an adhesive layer and a reflection layer involves (a) producing a LED stack on a first substrate, (b) producing a first reaction layer on this, (c) producing a reflection layer on a second substrate, (d) producing a second reaction layer on the reflection layer and (e) holding the first and second reaction layers together by means of a clear adhesive layer. Independent claims are also included for the following: (1) a variant (B) in which a reflecting metal substrate is used instead of a reflecting layer on a second substrate; (2) a variant (C) in which a reflection layer and then first reaction layer are produced on the LED stack and a second reaction layer is produced on the second substrate; (3) LEDs with a substrate, reflection layer, first reaction layer, clear adhesive layer, second reaction layer and LED stack produced on the second reaction layer; (4) LEDs with a substrate, first reflection layer, adhesive layer, second reaction layer, reflection layer and LED stack produced on the adhesive layer; (5) LEDs with a reflecting metal substrate, first reaction layer, clear adhesive layer, second reaction layer and LED stack produced on the second reaction layer.