| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a manufacturing method thereof that provides an inexpensive high frequency semiconductor package manufactured by a simple method. SOLUTION: The semiconductor package is formed by directly joining a substrate 1, formed through the use of a liquid crystal polymer and on the front side of which a semiconductor device 4 is mounted, with a lid 6 formed through the use of the liquid crystal polymer so that the semiconductor device 4 is hermetically placed in the inside without using an adhesive, and the inexpensive high frequency semiconductor package can easily be obtained through the configuration. COPYRIGHT: (C)2004,JPO
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