| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sputtering apparatus which inhibits a shield from expanding and contracting due to the heat of the shield by reducing a temperature change in the shield and keeping it at a constant temperature, and prevents a metal film adhering to the inner wall of the shield from peeling off. SOLUTION: The sputtering apparatus having the shield 4 installed on the inner wall of a treatment chamber 1, a target 3 installed on the top of the treatment chamber 1, and a stage 5 installed on a lower part of the treatment chamber 1, for performing sputtering treatment of a wafer 6 fixed on the stage 5, comprises a pipe 7 installed on the external wall of the shield 4, and a device 8 for producing water of a constant temperature, which is connected to the pipe 7 and controls the temperature of the shield 4 by passing a solvent in the pipe 7. COPYRIGHT: (C)2004,JPO
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