发明名称 |
PROTECTIVE COVER AND SEMICONDUCTOR DEVICE THEREWITH |
摘要 |
PROBLEM TO BE SOLVED: To provide a protective cover that can suppress the temperature rise of a component or semiconductor device to a low level by efficiently radiating the heat generated from the component to the outside and can be reduced in the number of used members. SOLUTION: This protective cover 21 has side plate sections 23 and 25 facing a substrate 13 on which a component 11 is mounted. The side plate sections 23 and 25 have directed plate sections 41 and 43 (143 or 241) which discharge an air flow B which is produced from an air flow A introduced into spaces between the side plate sections 23 and 25 and substrate 13 after the air flow A cools the component 11 to the outside of the sections 23 and 25. The directed plate sections 41 and 43 (143 or 241) confront the air flow A or B. In addition, this protective cover 21 has window sections 31 and 33 (131) through which the air flow A is taken in or the air flow B is discharged. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004071615(A) |
申请公布日期 |
2004.03.04 |
申请号 |
JP20020224615 |
申请日期 |
2002.08.01 |
申请人 |
ELPIDA MEMORY INC;RENESAS EASTERN JAPAN SEMICONDUCTOR INC;HITACHI LTD |
发明人 |
SAKAMOTO MASATAKA;TSUKUI SEIICHIRO;TANAKA MITSUYA;NAGAOKA KOJI |
分类号 |
H05K5/03;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K5/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|