发明名称 PROTECTIVE COVER AND SEMICONDUCTOR DEVICE THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a protective cover that can suppress the temperature rise of a component or semiconductor device to a low level by efficiently radiating the heat generated from the component to the outside and can be reduced in the number of used members. SOLUTION: This protective cover 21 has side plate sections 23 and 25 facing a substrate 13 on which a component 11 is mounted. The side plate sections 23 and 25 have directed plate sections 41 and 43 (143 or 241) which discharge an air flow B which is produced from an air flow A introduced into spaces between the side plate sections 23 and 25 and substrate 13 after the air flow A cools the component 11 to the outside of the sections 23 and 25. The directed plate sections 41 and 43 (143 or 241) confront the air flow A or B. In addition, this protective cover 21 has window sections 31 and 33 (131) through which the air flow A is taken in or the air flow B is discharged. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004071615(A) 申请公布日期 2004.03.04
申请号 JP20020224615 申请日期 2002.08.01
申请人 ELPIDA MEMORY INC;RENESAS EASTERN JAPAN SEMICONDUCTOR INC;HITACHI LTD 发明人 SAKAMOTO MASATAKA;TSUKUI SEIICHIRO;TANAKA MITSUYA;NAGAOKA KOJI
分类号 H05K5/03;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K5/03
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