| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe card, fulfilling a requirement densely forming probe needles necessary for testing a high-speed semiconductor chip with multi-terminals and arranging a decoupling capacitor for cutting high-frequency noise immediately close to a probe needle. <P>SOLUTION: The probe card comprises a plurality of probe needles 16 formed to respectively contact the electrode of inspecting object semiconductor chip 30, a build-up wiring layer 14 which has a multilayer wiring structure containing a plurality of wiring and is attached via the probe needles on the uppermost surface and connects with the wiring of each probe needle, and a capacitor 20 arranged to electrically connect with the semiconductor chip via the probe needles. The wiring of the build-up wiring layer 14 located close to each probe needle has a multilayer structure containing inner via. The capacitor 20 is formed by embedding in an insulation resin layer in the build-up wiring layer. <P>COPYRIGHT: (C)2004,JPO |
