| 摘要 |
PURPOSE: To provide a collet formed with a recess 10 brought into contact with one plate surface of a chip part and sucks the chip by evacuating the recess 10 in a contact state and picks up it, and can pick up even a chip part that is too thin to cause deformation during picking up without a strong suction force causing breakage, and to provide a method for picking up the chip part using the same. CONSTITUTION: The method is used to pick up a chip part. The collet is provided with a projection 12 which projects from the inner side surface 101 and/or the inner bottom surface 102 of a recess 10 and is brought into contact with the plate surface of the chip part in contact with the recess 10. Furthermore, the method includes a step where the collect is brought into contact with the chip so that a distance between at least one outer circumference edge of the chip to be picked up and the opening edge of the recess 10 is 0.001-0.3mm. |
