发明名称 MOLD FOR FORMING CONDUCTIVE LAYER AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a mold for forming a conductive layer and its manufacturing method for restricting the occurrence of a pollution in a production process of a flat panel display, etc. and of materializing a wiring with the high accuracy and reliability at low costs at the small number of steps. <P>SOLUTION: A recessed original form 9 corresponding to a given pattern is formed in a photoresist layer 8 arranged on a separating layer 7 of a substrate 6, and after a mold material layer 2A is filled in this original form 9, the back of the mold material layer 2A is flattened. After this flattened plane is joined to a backing 5, the separating layer 7 and the photoresist layer 8 are removed, thereby constituting a stamper 1 in which a projected molding part 2 is integrated with the backing 5 with a good mechanical strength. Thus, the projected molding part with the high accuracy is formed and a stamping is performed by using this stamper 1, so that a wiring pattern or the like can easily be formed. Therefore, a wiring step is simplified and it becomes possible to suppress the occurrence of the pollution due to waste chemical liquids, and reduce costs. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004071895(A) 申请公布日期 2004.03.04
申请号 JP20020230338 申请日期 2002.08.07
申请人 SONY CORP 发明人 WATANABE AKIHIKO;OHATA TOYOJI
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
主权项
地址