发明名称 |
Polishing pad design |
摘要 |
A method is provided for creating a polish pad. This may involve determining a design layout of a wafer. The design layout may include a distribution of metal line features on the wafer. A polish pad design may be created/determined based on the determined layer. The polish pad may have asperities having a width greater than a width of metal line features of the wafer.
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申请公布号 |
US2004043698(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
US20020228094 |
申请日期 |
2002.08.27 |
申请人 |
JIANG LEI;SHANKAR SADASIVAN;FISCHER PAUL |
发明人 |
JIANG LEI;SHANKAR SADASIVAN;FISCHER PAUL |
分类号 |
B24B37/04;B24D13/14;B24D18/00;(IPC1-7):B24B49/00;B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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