发明名称 |
Vortex heatsink for high performance thermal applications |
摘要 |
A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.
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申请公布号 |
US6698511(B2) |
申请公布日期 |
2004.03.02 |
申请号 |
US20020150730 |
申请日期 |
2002.05.17 |
申请人 |
INCEP TECHNOLOGIES, INC. |
发明人 |
DIBENE, II JOSEPH TED;RAISZADEH FARHAD |
分类号 |
H01L23/367;(IPC1-7):F28F7/00 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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