发明名称 |
Dummy structures that protect circuit elements during polishing |
摘要 |
Circuit elements (e.g. transistor gates) formed over a semiconductor substrate are protected by adjacent dummy structures during mechanical or chemical mechanical polishing of an overlying dielectric.
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申请公布号 |
US6700143(B2) |
申请公布日期 |
2004.03.02 |
申请号 |
US20020165741 |
申请日期 |
2002.06.06 |
申请人 |
MOSEL VITELIC, INC. |
发明人 |
TUAN HSING TI;LEUNG CHUNG WAI |
分类号 |
H01L21/3105;H01L21/8234;H01L21/8247;H01L27/105;H01L27/115;(IPC1-7):H01L31/119 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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