| 摘要 |
PURPOSE: A PCB(Printed Circuit Board) of a side plating structure and a fabricating method thereof are provided to protect circuits from magnetic field and electromagnetic waves by forming a conductive plating layer on each side of the PCB. CONSTITUTION: A PCB includes an insulating substrate and one or more conductor pattern layer(20). The conductor pattern layer(20) is formed on the insulating substrate. A plating layer(10) is formed on each side of the insulating substrate and the conductor pattern layer(20). The plating layer(10) is formed from each side of the insulating substrate and the conductor pattern layer to a rim of an upper face of the conductor pattern layer(20). The plating layer(10) is formed with materials selected from Au, Cu, Pb, and Ag.
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