| 摘要 |
FIELD: electrodeposition, in particular copper plating of steel. ^ SUBSTANCE: invention relates to electrolyte for copper plating useful in machine building and instrument engineering. Claimed electrolyte contains copper sulfate 75-85 g, ammonium sulfate 75-85 g, sodium sulfate 30-40 g, nickel sulfate 10-20 g, 25% aqueous ammonia solution 170-180 ml, N-methylpiperazide-2,3-pentamethylenequinoline-4-carboxylic acid 10-4-5x10-3 mol/l, and water up to 1 l. Invention makes its possible to obtain high quality electroplated coatings with fine-crystalline structure, mirror (brightness of 100 relative units), well adherent with base without using of intermediate layer, essentially nonporous, and without of steel base hydrogen charging (98,0-92,7 %). ^ EFFECT: electroplated coatings of high quality. ^ 3 tbl, 3 ex |
