METHOD FOR MAKING LOW-RESISTANCE BARRIER LAYER USING THE COPPER PROCESS,申请号SG20030000139-传众专利搜索

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发明名称	METHOD FOR MAKING LOW-RESISTANCE BARRIER LAYER USING THE COPPER PROCESS
摘要
申请公布号	SG102068(A1)	申请公布日期	2004.02.27
申请号	SG20030000139	申请日期	2003.01.23
申请人	TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD	发明人	HSIEN-MING LEE;SHING-CHUANG PAN;CHUNG-SHI LIU;CHEN-HUA YU
分类号	C23C16/34;C23C16/56;H01L21/02;H01L21/76;H01L23/52;(IPC1-7):C23C16/34	主分类号	C23C16/34
代理机构		代理人
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