| 摘要 |
<p>PURPOSE: A semiconductor package having a die pad fixed with a rivet is provided to be capable of improving the reliability of the semiconductor package and reducing semiconductor package manufacturing cost. CONSTITUTION: A semiconductor package(200) is provided with a lead frame(100) having an inner lead, an outer lead, and a tie bar(106), a rivet fixing type die pad(110) for being fixed to the tie bar of the lead frame by using a rivet(108), and a semiconductor chip(140) loaded at the rivet fixing type die pad using an adhesive part(130). The semiconductor package further includes a gold wire(150) for electrically connecting the semiconductor chip with the inner lead of the lead frame and an encapsulation part(160) for selectively enclosing the resultant structure.</p> |
